Skip to content
Menu
Menu
About
Sales Representatives
Employment
Products
Burn-in and Test Sockets
Burn-in and Test Printed Circuit Boards
Burn-in and Test Environmental Systems
Product Technical Data
Socket Applications
Socket Search
Blog
Contact Us
Sign In
Shopping Cart
(0)
Quotes
(0)
Express Ordering
By Keyword
By Item #
|
Burn-In and Test Sockets
Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets
Burn-In and Test Sockets
>
Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets
>
Item # 270SQ 558J6617
> Email Page
Email Page
In Reference To :
Item Details :
Item # 270SQ 558J6617 , 368 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket
Your Information
Send Email
Cancel
Required Fields
*
Recipient's Email *
*
Use Semicolon (;) for up to 5 addresses.
Your Email
*
Your Name
Send copy to self
Comments
reCAPTCHA
E-mail addresses are used for this mailing request only and are not saved or used for any other purposes. For security purposes, your IP address will be included in the E-mail.
Send Email
Cancel
