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Burn-In and Test Sockets
Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets
Burn-In and Test Sockets
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Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets
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Item # 270SQ 960J6617
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Item # 270SQ 960J6617 , 960 Input/Output (I/O) and 0.8 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket
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