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Device is 0.650 mm ±0.020 mm x 0.440 mm ±0.020 mm with a thickness of 0.29 mm ±0.03 mm. Pitches are: 0.23 mm and 0.22 mm
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 6

Pitch

 N/A Multi 0.22 mm0.23 mm

Array

 N/A 3 x 2

Number of Rows

 N/A 3

Number of Columns

 N/A 2

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 0.65 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.02 mm

Internal Socket Package Body Width (W)

 N/A 0.44 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.02 mm

Internal Socket Package Body Height (H/T)

 N/A 0.29 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.03 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 26.16 mm

Overall Socket Footprint Width (W)

 N/A 19.05 mm

Overall Socket Footprint Height (H/T)

 N/A 10.8 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free