This Package is 0.840 mm x 0.860 mm ±0.03 mm, overall thickness of 0.34 mm ±0.05 mm. 0.40 mm pitch, Interstitial 3 x 3array. Ball diameter 0.16 mm
Unit of Measure

Specifications

Brands

Loranger International Corp.

Package Name

BGA/CSP

Number of Input/Output (I/O)

5

Pitch

0.40 mm0.0157 in

Array

3 x 3, Interstitial

Kelvin Type

false

Socket Style

Clamshell

Ball Diameter

0.16 mm

Lead Time

2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

0.84 mm

Internal Socket Package Body Length (L) Tolerance

±0.03 mm

Internal Socket Package Body Width (W)

0.86 mm

Internal Socket Package Body Width (W) Tolerance

±0.03 mm

Internal Socket Package Body Height (H/T)

0.34 mm

Internal Socket Package Body Height (H/T) Tolerance

±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

26.16 mm

Overall Socket Footprint Width (W)

19.05 mm

Overall Socket Footprint Height (H/T)

10.8 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free