Item # 008SQ 004J6617, 4 Input/Output (I/O) and 0.40 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Package is 0.816 mm ±0.03 mm SQ, overall thickness of 0.575 mm ±0.05 mm. 0.40 mm pitch, full 2 x 2 array. Ball diameter 0.25 mm

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 4
Pitch	N/A 0.40 mm0.0157 in
Array	N/A 2 x 2
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Ball Diameter	N/A 0.25 mm
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 0.816 mm
Internal Socket Package Body Length (L) Tolerance	N/A ±0.03 mm
Internal Socket Package Body Width (W)	N/A 0.816 mm
Internal Socket Package Body Width (W) Tolerance	N/A ±0.03 mm
Internal Socket Package Body Height (H/T)	N/A 0.575 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.05 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 13.46 mm

N/A

Brands