Request Information Request Quote Add To Cart
This Package is 0.8 mm x 0.8 mm ±0.03 mm, overall thickness of 0.35 mm ±0.05 mm. 0.40 mm pitch, full 2 x 2 array. Ball diameter 0.24 mm. Two packages per socket.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 8

Pitch

 N/A 0.40 mm0.0157 in

Array

 N/A 2 x 2

Number of Rows

 N/A 2

Number of Columns

 N/A 2

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Ball Diameter

 N/A 0.24 mm

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 0.8 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.03 mm

Internal Socket Package Body Width (W)

 N/A 0.8 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.03 mm

Internal Socket Package Body Height (H/T)

 N/A 0.35 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 26.67 mm

Overall Socket Footprint Width (W)

 N/A 19.05 mm

Overall Socket Footprint Height (H/T)

 N/A 13.46 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free