Device L is 0.96 mm ±0.05 mm x W of 0.955 mm ±0.05 mm and T is 0.457 mm ±0.05 mm. Ball size 0.30 and ball height 0.25 mm
Unit of Measure

Specifications

Brands

Loranger International Corp.

Package Name

BGA/CSP

Number of Input/Output (I/O)

4

Pitch

0.50 mm0.02 in

Array

2 x 2

Number of Rows

2

Number of Columns

2

Kelvin Type

false

Socket Style

Clamshell

Ball Height

0.25 mm

Ball Size

0.30 mm

Lead Time

2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

0.96 mm

Internal Socket Package Body Length (L) Tolerance

±0.05 mm

Internal Socket Package Body Width (W)

0.96 mm

Internal Socket Package Body Width (W) Tolerance

±0.05 mm

Internal Socket Package Body Height (H/T)

0.457 mm

Internal Socket Package Body Height (H/T) Tolerance

±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

26.67 mm

Overall Socket Footprint Width (W)

19.05 mm

Overall Socket Footprint Height (H/T)

11.18 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free