Package is 1.093 mm ±0.03 mm L x 0.800 mm ±0.03 mm and T is 0.625 ±0.05. The ball dia is 0.25 mm ±0.03 mm. This is an interstitial package with 0.4 mm being the interstitial pitch.
Unit of Measure

Specifications

Brands

 Loranger International Corp.

Package Name

 BGA/CSP

Number of Input/Output (I/O)

 5

Pitch

 0.40 mm0.0157 in

Array

 3 x 3, Interstitial

Number of Rows

 3

Number of Columns

 3

Kelvin Type

 false

Socket Style

 Clamshell

Mounting

 Through-Hole

Ball Diameter

 0.25 mm

Ball Diameter Tolerance

 ±0.03 mm

Lead Time

 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 1.093 mm

Internal Socket Package Body Length (L) Tolerance

 ±0.03 mm

Internal Socket Package Body Width (W)

 0.8 mm

Internal Socket Package Body Width (W) Tolerance

 ±0.03 mm

Internal Socket Package Body Height (H/T)

 0.625 mm

Internal Socket Package Body Height (H/T) Tolerance

 ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 26.67 mm

Overall Socket Footprint Width (W)

 19.05 mm

Overall Socket Footprint Height (H/T)

 13.97 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free