Item # 014SQ 009U6617, 9 Input/Output (I/O) and 0.50 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Package has an overall thickness of 0.874 mm ±0.05 mm. CSF, 0.50 mm pitch, full 3 x 3 array. Ball diameter 0.17 mm ±0.01 mm P/N 020014012U6617

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 9
Pitch	N/A 0.50 mm0.02 in
Array	N/A 3 x 3, 8X packages
Number of Rows	N/A 3
Number of Columns	N/A 3
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Ball Diameter	N/A 0.17 mm
Ball Diameter Tolerance	N/A ±0.01 mm
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 1.43 mm
Internal Socket Package Body Width (W)	N/A 1.43 mm
Internal Socket Package Body Height (H/T)	N/A 0.874 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.05 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 16.51 mm

N/A

Brands