Item # 020014011J6617, 11 Input/Output (I/O) and 0.50 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

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The overall Package thickness is 0.40 mm ±0.05 mm. Middle column is interstitial and 3 I/O.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 11
Pitch	N/A 0.50 mm0.02 in
Array	N/A 4 x 3 interstitial
Number of Rows	N/A 4
Number of Columns	N/A 3
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 2.00 mm
Internal Socket Package Body Width (W)	N/A 1.4 mm
Internal Socket Package Body Height (H/T)	N/A 0.4 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 13.46 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free