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BGA package size 2.16 mm ±0.10 mm L and 2.01 ± 0.10 mm W. .575 ± 0.05 mm With 16 balls @ .30 mm ± 0.05 mm diameter.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 16

Pitch

 N/A 0.50 mm0.02 in

Array

 N/A 4 x 4

Number of Rows

 N/A 4

Number of Columns

 N/A 4

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Ball Diameter

 N/A 0.30 mm

Ball Diameter Tolerance

 N/A ±0.05 mm

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 2.16 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.10 mm

Internal Socket Package Body Width (W)

 N/A 2.01 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.10 mm

Internal Socket Package Body Height (H/T)

 N/A 0.575 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 26.67 mm

Overall Socket Footprint Width (W)

 N/A 19.05 mm

Overall Socket Footprint Height (H/T)

 N/A 11.43 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free