Item # 022014008U6617, 8 Input/Output (I/O) and 0.50 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

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BGA package size 2.24 L and 1.49 W. With 8 balls @ .30 diameter.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 8
Pitch	N/A 0.50 mm0.02 in
Array	N/A 2 x 4
Number of Rows	N/A 4
Number of Columns	N/A 2
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Ball Diameter	N/A 0.30 mm
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 2.24 mm
Internal Socket Package Body Width (W)	N/A 1.49 mm
Internal Socket Package Body Height (H/T)	N/A 0.67 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 11.18 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free