BGA package is 2.225 mm ±0.025 mm L x 2.276 ±-0.025 mm W and T is 0.55 mm ±0.05 mm. Ball size 0.28 ±0.02 mm
Unit of Measure
Specifications
|
Internal Socket Area (Package Dimensions)
|
Overall Socket Area
|
Additional Information
Specifications
Brands |
N/A Loranger International Corp. |
Package Name |
N/A BGA/CSP |
Number of Input/Output (I/O) |
N/A 25 |
Pitch |
N/A 0.40 mm0.0157 in |
Array |
N/A 5 x 5 |
Kelvin Type |
N/A false |
Socket Style |
N/A Clamshell |
Ball Size |
N/A 0.28 mm |
Ball Size Tolerance (±) |
N/A 0.02 mm |
Lead Time |
N/A 2 to 4 week |
Internal Socket Area (Package Dimensions)
Internal Socket Package Body Length (L) |
N/A 2.276 mm |
Internal Socket Package Body Length (L) Tolerance |
N/A ±0.025 mm |
Internal Socket Package Body Width (W) |
N/A 2.225 mm |
Internal Socket Package Body Width (W) Tolerance |
N/A ±0.025 mm |
Internal Socket Package Body Height (H/T) |
N/A 0.55 mm |
Internal Socket Package Body Height (H/T) Tolerance |
N/A ±0.05 mm |
