Item # 025025025J6617, 25 Input/Output (I/O) and 0.45 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Micro BGA package with APS contacts. 5 x 5 fully populated array.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 25
Pitch	N/A 0.45 mm0.0177 in
Array	N/A 5 x 5
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 2.57 mm
Internal Socket Package Body Width (W)	N/A 2.52 mm
Internal Socket Package Body Height (H/T)	N/A 0.76 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 13.46 mm

N/A

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