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The package is 3.193 mm ±0.03 mm L, 2.071 mm ±0.03 mm L x 0.55 mm ±0.03 mm T. Six solder balls are depopulated.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 29

Pitch

 N/A 0.40 mm0.016 in

Array

 N/A 7 x 5, D

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 3.193 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.03 mm

Internal Socket Package Body Width (W)

 N/A 2.071 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.03 mm

Internal Socket Package Body Height (H/T)

 N/A 0.55 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.03 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 26.67 mm

Overall Socket Footprint Width (W)

 N/A 19.05 mm

Overall Socket Footprint Height (H/T)

 N/A 13.46 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free