- Burn-In and Test SocketsBurn-In and Test Sockets
- Ball Grid Array (BGA)/Chip Scale Package (CSP) SocketsBall Grid Array (BGA)/Chip Scale Package (CSP) Sockets
- Item # 040031043J6617
040031043J6617
QUOTE
- Description
- Specifications
- Internal Socket Area (Package Dimensions)
- Overall Socket Area
- Additional Information
040031043J6617
This package is 4.055 mm ±0.02 mm L x 3.170 mm ±.02 mm W x 0..38 mm ±0.03 mm T. There are two, 9 x3 depopulated arrays on this package.
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| Brands | N/A Loranger International Corp. |
| Package Type | N/A BGA/CSP |
| Number of Package Leads (I/O) | N/A 43 |
| Pitch | N/A 0.40 mm0.0157 in |
| Array | N/A 9 x 3 D |
| Number of Rows | N/A 9 |
| Number of Columns | N/A 3 |
| Kelvin Type | N/A false |
| Socket Style | N/A Clamshell |
| Mounting | N/A Surface Mount |
| Lead Time | N/A 2 to 4 week |
| Internal Socket Package Body Length (L) | N/A 4.055 mm |
| Internal Socket Package Body Length (L) Tolerance | N/A ±0.02 mm |
| Internal Socket Package Body Width (W) | N/A 3.17 mm |
| Internal Socket Package Body Width (W) Tolerance | N/A ±0.02 mm |
| Internal Socket Package Body Height (H/T) | N/A .38 mm |
| Internal Socket Package Body Height (H/T) Tolerance | N/A ±0.03 mm |
| Overall Socket Footprint Length (L) | N/A 26.67 mm |
| Overall Socket Footprint Width (W) | N/A 19.05 mm |
| Overall Socket Footprint Height (H/T) | N/A 13.46 mm |
N/A
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