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Solder Balls are .020" ±.0020"
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 384

Pitch

 N/A 1 mm0.039 in

Array

 N/A 25 x 23, D

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Ball Diameter

 N/A 0.020 in

Ball Diameter Tolerance

 N/A ±0.0020 in

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 29.46 mm

Internal Socket Package Body Width (W)

 N/A 33.78 mm

Internal Socket Package Body Height (H/T)

 N/A 3.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 50.55 mm

Overall Socket Footprint Width (W)

 N/A 42.16 mm

Overall Socket Footprint Height (H/T)

 N/A 11.43 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free