Item # 063051022J6617, 40 Input/Output (I/O) and 0.65 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Request Information Request Quote Add To Cart

This Package has an overall thickness of 1.025 mm +.09 mm -0.055 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 40
Pitch	N/A 0.65 mm0.026 in
Array	N/A 4 x 5, 4 on 2, plus 2
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 6.3 mm
Internal Socket Package Body Length (L) Tolerance	N/A +0.09 mm-0.055 mm
Internal Socket Package Body Width (W)	N/A 5.2 mm
Internal Socket Package Body Height (H/T)	N/A 1.025 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 11.43 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free