Item # 065062131J6617, 131 Input/Output (I/O) and 0.50 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Package has an overall thickness of 0.91 mm ±0.05 mm. This is an interstitial pitch package with a depopulated array.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 131
Pitch	N/A 0.50 mm0.0197 in
Array	N/A 13 x 14, D
Number of Rows	N/A 14
Number of Columns	N/A 13
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 6.5 mm
Internal Socket Package Body Width (W)	N/A 6.20 mm
Internal Socket Package Body Height (H/T)	N/A 0.91 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 16.51 mm

N/A

Brands