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This Package is 8.0 mm ±0.1 mm SQ, with a thickness of 1.12 mm ±0.18 mm, 0.8 mm pitch, 9 X 9 array. Ball diameter .40 ±.1 mm.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 81

Pitch

 N/A 0.8 mm0.031 in

Array

 N/A 9 x 9

Number of Rows

 N/A 9

Number of Columns

 N/A 9

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Ball Diameter

 N/A 0.40 mm

Ball Diameter Tolerance

 N/A ±0.1 mm

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 8 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.10 mm

Internal Socket Package Body Width (W)

 N/A 8.00 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.10 mm

Internal Socket Package Body Height (H/T)

 N/A 1.12 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.18 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 26.67 mm

Overall Socket Footprint Width (W)

 N/A 19.05 mm

Overall Socket Footprint Height (H/T)

 N/A 16.51 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free