Item # 080SQ 225J6617, 225 Input/Output (I/O) and 0.50 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

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This Package is 8.00 mm ±0.10 mm SQ x 0.96 mm ±0.10 mm T. Ball dia 0.30 mm ±0.05 mm. Ball height 0.21 mm ±0.05 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 225
Pitch	N/A 0.50 mm0.0197 in
Array	N/A 15 x 15
Number of Rows	N/A 15
Number of Columns	N/A 15
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Ball Diameter	N/A 0.3 mm
Ball Diameter Tolerance	N/A ±0.05 mm
Ball Height	N/A 0.21 mm
Ball Height Tolerance (±)	N/A 0.05 mm
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 8 mm
Internal Socket Package Body Length (L) Tolerance	N/A ±0.10 mm
Internal Socket Package Body Width (W)	N/A 8.00 mm
Internal Socket Package Body Width (W) Tolerance	N/A ±0.10 mm
Internal Socket Package Body Height (H/T)	N/A 0.96 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.10 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 11.43 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free