Request Information Request Quote Add To Cart
This BGA Package is 8.00 mm ±0.10 mm SQ x 0.91 mm ±0.05 mm T. Ball dia 0.25 mm ±0.05 mm. Height 0.20 mm ±0.05 mm.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 244

Pitch

 N/A 0.40 mm0.016 in

Array

 N/A 18 x 18, D

Number of Rows

 N/A 18

Number of Columns

 N/A 18

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Ball Diameter

 N/A 0.25 mm

Ball Diameter Tolerance

 N/A ±0.05 mm

Ball Height

 N/A 0.20 mm

Ball Height Tolerance (±)

 N/A 0.05 mm

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 8 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.10 mm

Internal Socket Package Body Width (W)

 N/A 8.00 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.10 mm

Internal Socket Package Body Height (H/T)

 N/A 0.91 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 26.67 mm

Overall Socket Footprint Width (W)

 N/A 19.05 mm

Overall Socket Footprint Height (H/T)

 N/A 13.59 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free