Item # 090SQ 064B6617, 64 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Package has micro size balls necessitating a uBGA type contact pressure. This Package is 1.13 mm T.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 64
Pitch	N/A 1 mm0.039 in
Array	N/A 8 x 8
Number of Rows	N/A 8
Number of Columns	N/A 8
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 9 mm
Internal Socket Package Body Width (W)	N/A 9 mm
Internal Socket Package Body Height (H/T)	N/A 1.13 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 12.88 mm

N/A

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