Item # 090SQ 100J6618C, 100 Input/Output (I/O) and 0.8 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Package is 9.00 mm SQ & has an overall thickness of 1.56 mm ±0.10 mm. 10 x 10 fully populated array. Cover-mounted finned heat sink.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 100
Pitch	N/A 0.8 mm0.031 in
Array	N/A 10 x 10
Number of Rows	N/A 10
Number of Columns	N/A 10
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 9 mm
Internal Socket Package Body Width (W)	N/A 9 mm
Internal Socket Package Body Height (H/T)	N/A 1.56 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 27.69 mm

N/A

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