Item # 100SQ 057J6617, 57 Input/Output (I/O) and 0.8 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Package has an overall thickness of 0.71 mm ±0.10 mm. Depopulated contact pattern, with a access hole cut out in the bottom of the socket.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 57
Pitch	N/A 0.8 mm0.031 in
Array	N/A 12 x 12, D
Number of Rows	N/A 12
Number of Columns	N/A 12
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 10.00 mm
Internal Socket Package Body Width (W)	N/A 10 mm
Internal Socket Package Body Height (H/T)	N/A .71 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.10 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 11.3 mm

N/A

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