Item # 105065135U6617, 135 Input/Output (I/O) and 0.65 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Package is 10.5 mm ±0.10 mm x 6.5 mm ±0.10 mm. Thickness is 0.95 mm ±0.05 mm. Fully populated array.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 135
Pitch	N/A 0.65 mm0.0256 in
Array	N/A 15 x 9
Number of Rows	N/A 9
Number of Columns	N/A 15
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 10.5 mm
Internal Socket Package Body Width (W)	N/A 6.5 mm
Internal Socket Package Body Height (H/T)	N/A 0.95 mm

Overall Socket Footprint Length (L)	N/A 37.34 mm
Overall Socket Footprint Width (W)	N/A 26.67 mm
Overall Socket Footprint Height (H/T)	N/A 15.24 mm

N/A

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