Item # 107056046U6617, 44 Input/Output (I/O) and 0.65 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Fits memory DUT Package without an interposer. 8 x 6 ball matrix has positions "A1" and "F1" depopulated.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 44
Pitch	N/A 0.65 mm0.026 in
Array	N/A 8 x 6, D
Number of Rows	N/A 8
Number of Columns	N/A 6
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 10.71 mm
Internal Socket Package Body Width (W)	N/A 5.6 mm
Internal Socket Package Body Height (H/T)	N/A 0.96 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 37.34 mm
Overall Socket Footprint Height (H/T)	N/A 16.51 mm

N/A

Brands