Item # 110SQ 100B6618A, 100 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

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The Package thickness is 1.29 mm ±0.10 mm. Also, the larger ball diameter is 0.635 mm ±0.10 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A FLEXBGA
Number of Input/Output (I/O)	N/A 100
Pitch	N/A 1 mm0.039 in
Array	N/A 10 x 10
Number of Rows	N/A 10
Number of Columns	N/A 10
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Ball Diameter	N/A 0.635 mm
Ball Diameter Tolerance	N/A ±0.10 mm
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 11 mm
Internal Socket Package Body Width (W)	N/A 11 mm
Internal Socket Package Body Height (H/T)	N/A 1.29 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.10 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 12.88 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free