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This uBGA Package is 0.060" ±0 .004" T with pressure being taken only on the laminate at 0.030" T leaving clearance for the silicon die that is overflow protected. Also note that 2 of the 106 balls are on an interstitial pitch in the inner row.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 106

Pitch

 N/A 0.65 mm0.026 in

Array

 N/A 12 x 12, D

Number of Rows

 N/A 12

Number of Columns

 N/A 12

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 11 mm

Internal Socket Package Body Width (W)

 N/A 11 mm

Internal Socket Package Body Height (H/T)

 N/A 1.52 mm0.060 in

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.004 in

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 37.34 mm

Overall Socket Footprint Width (W)

 N/A 26.67 mm

Overall Socket Footprint Height (H/T)

 N/A 16.51 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free