Item # 120050119U6617, 119 Input/Output (I/O) and 0.65 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Package is 12.0 mm ±0.05 mm L, 5.00 mm ±0.05 mm, overall thickness of 0.95 mm ±0.05 mm. 0.65 mm pitch, full 17 x 7 array. Ball diameter 0.30 mm

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 119
Pitch	N/A 0.65 mm0.0256 in
Array	N/A 17 x 7
Number of Rows	N/A 17
Number of Columns	N/A 7
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Ball Diameter	N/A 0.30 mm
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 12.00 mm
Internal Socket Package Body Length (L) Tolerance	N/A ±0.05 mm
Internal Socket Package Body Width (W)	N/A 5 mm
Internal Socket Package Body Width (W) Tolerance	N/A ±0.05 mm
Internal Socket Package Body Height (H/T)	N/A 0.95 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.05 mm

Overall Socket Footprint Length (L)	N/A 37.34 mm
Overall Socket Footprint Width (W)	N/A 26.67 mm
Overall Socket Footprint Height (H/T)	N/A 15.24 mm

N/A

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