Item # 120080064U6618A, 64 Input/Output (I/O) and 0.8 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Request Information Request Quote Add To Cart

Ships with 64 contacts, even though the Package only has 58 active solder balls.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 64
Pitch	N/A 0.8 mm0.031 in
Array	N/A 8 x 12, D
Number of Rows	N/A 8
Number of Columns	N/A 8
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 12.00 mm
Internal Socket Package Body Width (W)	N/A 8.00 mm
Internal Socket Package Body Height (H/T)	N/A 1.3 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 16.51 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free