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This Package is 1.326 mm ±0.05 mm L x 0.818 mm ±0.05 mm W. Package thickness is 0.88 mm ±0.05 mm. The ball arrangement is one ball in each of the 4 corners of the Package 1 ball in the center.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 54

Pitch

 N/A 1 mm0.039 in

Array

 N/A 8 x 8, D

Number of Rows

 N/A 8

Number of Columns

 N/A 8

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 13 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.05 mm

Internal Socket Package Body Width (W)

 N/A 10 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.05 mm

Internal Socket Package Body Height (H/T)

 N/A 1.3 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 37.34 mm

Overall Socket Footprint Width (W)

 N/A 26.67 mm

Overall Socket Footprint Height (H/T)

 N/A 16.94 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free