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This Micro BGA Package is 13.00 mm ±0.10 mm SQ x 1.16 mm ±0.10 mm. Ball DIA .035 mm ±0.05 mm, Ball Height 0.26 ±0.05 mm
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 224

Pitch

 N/A 0.8 mm0.031 in

Array

 N/A 15 x 15, D

Number of Rows

 N/A 15

Number of Columns

 N/A 15

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Ball Diameter

 N/A 0.035 mm

Ball Diameter Tolerance

 N/A ±0.05 mm

Ball Height

 N/A 0.26 mm

Ball Height Tolerance (±)

 N/A 0.05 mm

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 13 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.10 mm

Internal Socket Package Body Width (W)

 N/A 13 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.10 mm

Internal Socket Package Body Height (H/T)

 N/A 1.16 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.10 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 37.34 mm

Overall Socket Footprint Width (W)

 N/A 26.67 mm

Overall Socket Footprint Height (H/T)

 N/A 15.37 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free