Item # 144122106U6618A, 106 Input/Output (I/O) and 0.75 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Request Information Request Quote Add To Cart

This Package is 14.40 mm L x 12.25 mm W x 0.81 mm T. Ball diameter is 0.50 mm ±0.05 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 106
Pitch	N/A 0.75 mm0.03 in
Array	N/A 16 x 18, D
Number of Rows	N/A 16
Number of Columns	N/A 18
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Ball Diameter	N/A 0.50 mm
Ball Diameter Tolerance	N/A ±0.05 mm
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 14.40 mm
Internal Socket Package Body Width (W)	N/A 12.25 mm
Internal Socket Package Body Height (H/T)	N/A 0.81 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 37.34 mm
Overall Socket Footprint Width (W)	N/A 26.67 mm
Overall Socket Footprint Height (H/T)	N/A 16.94 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free