Item # 150SQ 144B6617, 144 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

14 x 14 outer row of balls extend 3 balls deep for 132, plus 12 center balls for a total of 144

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 144
Pitch	N/A 1 mm0.039 in
Array	N/A 14 x 14, D
Number of Rows	N/A 14
Number of Columns	N/A 14
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 15 mm
Internal Socket Package Body Width (W)	N/A 15 mm
Internal Socket Package Body Height (H/T)	N/A 1.54 mm

Overall Socket Footprint Length (L)	N/A 37.34 mm
Overall Socket Footprint Width (W)	N/A 26.67 mm
Overall Socket Footprint Height (H/T)	N/A 16.94 mm

N/A

Brands