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  • 0.22 mm Pitch and Greater
  • Accommodates Package Height Variations
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Contacts Connect Solder ball to Board Pad
  • Optional Heat Sink
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 228

Pitch

 N/A 1 mm0.039 in

Array

 N/A 16 x 16, D

Number of Rows

 N/A 16

Number of Columns

 N/A 16

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 17.00 mm

Internal Socket Package Body Width (W)

 N/A 17.00 mm

Internal Socket Package Body Height (H/T)

 N/A 1.91 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 37.34 mm

Overall Socket Footprint Width (W)

 N/A 26.67 mm

Overall Socket Footprint Height (H/T)

 N/A 15.49 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free