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For mounting on E-beam probe machine to TEST BGA Packages. Similar to standard sockets but with addition of one latch at the end where the cover is normally hinged. Loose cover is manually applied after insertion of DUT. Cover is machined to have a 0.380" square hole for the cavity-up E-beam approach. Customer-supplied PCB has countersunk nut location.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 256

Pitch

 N/A 1 mm0.039 in

Array

 N/A 16 x 16

Number of Rows

 N/A 16

Number of Columns

 N/A 16

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 17.00 mm

Internal Socket Package Body Width (W)

 N/A 17.00 mm

Internal Socket Package Body Height (H/T)

 N/A 1.56 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 37.34 mm

Overall Socket Footprint Width (W)

 N/A 26.67 mm

Overall Socket Footprint Height (H/T)

 N/A 16.94 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free