Item # 190SQ 324B6618D, 324 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

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This Package is 19.0 mm ±0.20 mm SQ x 1.81 mm ±0.19 mm T. The ball diameter is 0.50 mm ±0.05 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 324
Pitch	N/A 1 mm0.039 in
Array	N/A 18 x 18, D
Number of Rows	N/A 18
Number of Columns	N/A 18
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Ball Diameter	N/A 0.50 mm
Ball Diameter Tolerance	N/A ±0.05 mm
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 19.00 mm
Internal Socket Package Body Length (L) Tolerance	N/A ±0.20 mm
Internal Socket Package Body Width (W)	N/A 19.00 mm
Internal Socket Package Body Width (W) Tolerance	N/A ±0.20 mm
Internal Socket Package Body Height (H/T)	N/A 1.81 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.19 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 42.16 mm
Overall Socket Footprint Width (W)	N/A 33.53 mm
Overall Socket Footprint Height (H/T)	N/A 15.37 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free