Item # 190SQ 375U6617, 375 Input/Output (I/O) and 0.8 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

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The overall Package thickness is 1.87 mm +.18 mm -.15 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 375
Pitch	N/A 0.8 mm0.031 in
Array	N/A 22 x 22, D
Number of Rows	N/A 22
Number of Columns	N/A 22
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 19.00 mm
Internal Socket Package Body Width (W)	N/A 19.00 mm
Internal Socket Package Body Height (H/T)	N/A 2.07 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 40.13 mm
Overall Socket Footprint Width (W)	N/A 30.48 mm
Overall Socket Footprint Height (H/T)	N/A 16.26 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free