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This Package is 25.00 mm ±0.20 mm x 21.00 mm ±0.20 mm Package thickness is 3.50 mm ±0.10 mm. Ball dia is 0.80 mm ±0.05 mm. These come in 2 flavors the 1st one illustrated on page 2 of 3 has 2 different heights to the flip chip package and the die smaller on 2 of the 3 flip chip package than the alternative package shown on page 3 of 3. Revised heat sink cover, 2.38 mm was 3.36 mm revised thermally conductive pad, .015" T was .020" T revised heat sink to eliminate blind tap.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 255

Pitch

 N/A 1.27 mm0.05 in

Array

 N/A 16 x 16, D

Number of Rows

 N/A 16

Number of Columns

 N/A 16

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Ball Diameter

 N/A 0.80 mm

Ball Diameter Tolerance

 N/A ±0.05 mm

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 25 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.20 mm

Internal Socket Package Body Width (W)

 N/A 21.00 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.20 mm

Internal Socket Package Body Height (H/T)

 N/A 3.50 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.10 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 45.97 mm

Overall Socket Footprint Width (W)

 N/A 38.61 mm

Overall Socket Footprint Height (H/T)

 N/A 27.99 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free