Item # 270SQ 352B6618A, 352 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Comes with a standard heatsink that brings overall socket height to a maximum of 50.00 mm

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 352
Pitch	N/A 1.27 mm0.05 in
Array	N/A 20 x 20, D
Number of Rows	N/A 26
Number of Columns	N/A 26
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 27.00 mm
Internal Socket Package Body Width (W)	N/A 27.00 mm
Internal Socket Package Body Height (H/T)	N/A 2.47 mm

Overall Socket Footprint Length (L)	N/A 45.97 mm
Overall Socket Footprint Width (W)	N/A 38.61 mm
Overall Socket Footprint Height (H/T)	N/A 16.94 mm

N/A

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