Item # 270SQ 668B6617, 668 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

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The overall Package thickness is 2.65 mm +0.20 mm -0.00 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 668
Pitch	N/A 1 mm0.039 in
Array	N/A 26 x 26
Number of Rows	N/A 26
Number of Columns	N/A 26
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 27.00 mm
Internal Socket Package Body Length (L) Tolerance	N/A +0.20 mm-0.00 mm
Internal Socket Package Body Width (W)	N/A 27.00 mm
Internal Socket Package Body Height (H/T)	N/A 2.65 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 45.97 mm
Overall Socket Footprint Width (W)	N/A 38.61 mm
Overall Socket Footprint Height (H/T)	N/A 15.37 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free