Item # 350SQ 313B6618A, 313 Input/Output (I/O) and 3.592 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

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The overall Package thickness is 3.03 mm ±0.10 mm. Interstitial Pitch

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 313
Pitch	N/A 3.592 mm0.141 in
Array	N/A 25 x 25, Interstitial
Number of Rows	N/A 25
Number of Columns	N/A 25
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 35.00 mm
Internal Socket Package Body Width (W)	N/A 35.00 mm
Internal Socket Package Body Height (H/T)	N/A 3.03 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 55.63 mm
Overall Socket Footprint Width (W)	N/A 48.26 mm
Overall Socket Footprint Height (H/T)	N/A 20.12 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free