Item # 350SQ1156B6618C, 1152 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Package is 35.00 mm ±0.15 mm SQ x 3.20 mm ±0.10 mm T. The socket has a compliant cover.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 1152
Pitch	N/A 1 mm0.039 in
Array	N/A 34 x 34, D
Number of Rows	N/A 34
Number of Columns	N/A 34
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 35.00 mm
Internal Socket Package Body Width (W)	N/A 35.00 mm
Internal Socket Package Body Height (H/T)	N/A 3.20 mm

Overall Socket Footprint Length (L)	N/A 68.58 mm
Overall Socket Footprint Width (W)	N/A 59.44 mm
Overall Socket Footprint Height (H/T)	N/A 25.40 mm

N/A

Brands