Item # 350SQD352B6618A, 352 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

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Mounted on E-beam probe machine to TEST 35 mm square cavity-down Packages that are 1.50 mm T. Has overall height of 0.425" max to fit into the machine opening.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 352
Pitch	N/A 1.27 mm0.05 in
Array	N/A 26 x 26, D
Number of Rows	N/A 26
Number of Columns	N/A 26
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 35.00 mm
Internal Socket Package Body Width (W)	N/A 35.00 mm
Internal Socket Package Body Height (H/T)	N/A 1.5 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 56.13 mm
Overall Socket Footprint Width (W)	N/A 48.26 mm
Overall Socket Footprint Height (H/T)	N/A 12.37 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free