Item # 375SQ 553B6617, 553 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Request Information Request Quote Add To Cart

The overall Package thickness is 2.33 mm ±0.05 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 553
Pitch	N/A 1.27 mm0.05 in
Array	N/A 29 x 29, D
Number of Rows	N/A 29
Number of Columns	N/A 29
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 37.50 mm
Internal Socket Package Body Width (W)	N/A 37.50 mm
Internal Socket Package Body Height (H/T)	N/A 2.33 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 60.71 mm
Overall Socket Footprint Width (W)	N/A 53.34 mm
Overall Socket Footprint Height (H/T)	N/A 25.91 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free