Item # 400SQ 432B6617, 432 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Request Information Request Quote Add To Cart

This super BGA package thickness is 1.54 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 432
Pitch	N/A 1.27 mm0.05 in
Array	N/A 31 x 31, D
Number of Rows	N/A 31
Number of Columns	N/A 31
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 40.00 mm
Internal Socket Package Body Width (W)	N/A 40.00 mm
Internal Socket Package Body Height (H/T)	N/A 1.54 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 60.71 mm
Overall Socket Footprint Width (W)	N/A 53.34 mm
Overall Socket Footprint Height (H/T)	N/A 20.12 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free