Item # 400SQ 913B6617, 913 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

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The overall Package thickness is 2.23 mm ±0.13 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 913
Pitch	N/A 1 mm0.039 in
Array	N/A 39 x 39, D
Number of Rows	N/A 39
Number of Columns	N/A 39
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 40.00 mm
Internal Socket Package Body Width (W)	N/A 40.00 mm
Internal Socket Package Body Height (H/T)	N/A 2.23 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.13 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 60.71 mm
Overall Socket Footprint Width (W)	N/A 53.34 mm
Overall Socket Footprint Height (H/T)	N/A 25.91 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free