Item # 450SQ 655B6617, 655 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Cover bears on overall thickness of 1.46 mm on this Step Package. Additional height for covered die of 1.14 mm is open in cover.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 655
Pitch	N/A 1.27 mm0.05 in
Array	N/A 34 x 34, D
Number of Rows	N/A 34
Number of Columns	N/A 34
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 45.00 mm
Internal Socket Package Body Width (W)	N/A 45.00 mm
Internal Socket Package Body Height (H/T)	N/A 2.6 mm

Overall Socket Footprint Length (L)	N/A 65.79 mm
Overall Socket Footprint Width (W)	N/A 58.42 mm
Overall Socket Footprint Height (H/T)	N/A 25.91 mm

N/A

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