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This Package is 50.00 mm ±0.10 mm SQ x 3.23 mm ±0.25 mm T. Ball diameter is 0.60 mm ±0.05 mm. The cover is a complaint cover with a heat sink. Heat sink size and orientation is optimized for an MCC HB5 chamber. Also has two heater cartridges and one RTD.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 2401

Pitch

 N/A 1 mm0.039 in

Array

 N/A 49 x 49

Number of Rows

 N/A 49

Number of Columns

 N/A 49

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Ball Diameter

 N/A 0.60 mm

Ball Diameter Tolerance

 N/A ±0.05 mm

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 50.00 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.10 mm

Internal Socket Package Body Width (W)

 N/A 50.00 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.10 mm

Internal Socket Package Body Height (H/T)

 N/A 3.23 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.25 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 82.55 mm

Overall Socket Footprint Width (W)

 N/A 86.36 mm

Overall Socket Footprint Height (H/T)

 N/A 34.54 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free